Thermoelectric composite semiconductor

ABSTRACT

Heat transfer to refrigerate or heat uses a thermoelectric semiconductor structure including a P-type composite of dices of semiconductor material alloyed with P-type material forming spaced collector regions at junctions with a P-type conductive material for flux of electrical current and a N-type composite of dices of semiconductor material alloyed with N-type material forming spaced collector regions at junctions with a N-type conductive material for flux of electrical current. The thickness of each the dices is sufficient to form a PN junction. Electrically conductive buss bars form an electrical circuit between the dices of N-type conductivity and the dices of P-type conductivity. An electrically conductive buss bar forms an electrical circuit connection between the dices of N-type conductivity and the dices of P-type conductivity. An electrical potential is applied by terminals between the P-type composite and the N-type composite to induce a flux of heat concurrent with the flux of electrical current.

CROSS-REFERENCE TO RELATED APPLICATIONS

Not applicable

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to a thermoelectric semiconductorstructure comprised of one or both of a P-type composite and an N-typecomposite concurrently conductive of heat flux and electric flux withlow electric flux losses for versatile and high efficiencythermoelectric operations.

Both N-type and P-type thermoelectric semiconductor materials aretypical used in a thermoelectric cooler module as schematicallyillustrated in FIG. 1 according to the prior Art. Heat is caused to movethrough the thermoelectric cooler module in one direction as identifiedby Arrows A while electrical current i passes between the cold junctionelectrode C and hot junction electrode H through each of thethermoelectric N-type semiconductor material and the thermoelectricP-type semiconductor material. The N-type semiconductor material isdoped to have an excess of electrons, i.e. more electrons than needed tocomplete a perfect molecular lattice structure, and P-type semiconductormaterial is doped so that it will have a deficiency of electrons, i.e.fewer electrons than are necessary to complete a perfect latticestructure. The extra electrons in the N-type semiconductor material andthe holes resulting from the deficiency of electrons in the P-typesemiconductor material are the carriers which move the heat energythrough the thermoelectric semiconductor materials. Most thermoelectriccooling modules are fabricated with an equal number of N-type and P-typesemiconductors where a pair of N-type and P-type elements come togetherto form a thermoelectric couple. The present invention is founded on therealization that the thermoelectric phenomenon occurring when usingsemiconductor materials of both N-type and P-type cause unfavorableoperating performance because the heat conduction and electrical flowproperties are different in each of the N-type and P-type semiconductormaterials.

Both Peltier effect and Joule heating effect play very important rolesin thermoelectric phenomenon. The Peltier effect takes place at a PNjunction only but the Joule heating affect is distributed along entirelength of the elements. The rate at which heat is generated by Joule'seffect is directly proportional to the square of the electric currentwhereas the rate at which heat is generated by the Peltier effect isdirectly proportional to the current. Heat is always generated in Jouleheating effect, whereas in the Peltier effect heat is evolved at onejunction and absorbed at the other. It is for these underlyingprincipals that the Composite Semi-conductive ThermoelectricRefrigerating illustrated and described in U.S. Pat. No. 5,156,004suffers from the unfavorable operation performance.

The P-type and N-type semiconductor elements or dices act as theelectric lane to conduct heat from the cold junction to the hot junctionby an electric current. The P-type and N-type semiconductor elementsalso serve to separate the cold junction and the hot junction to avoidheat transfer from dices from the hot junction to the cold junction. Tosignificantly enhance the cooling effect, it is necessary to find amaterial or structure to make both dices have a maximum heat deliveringcapability and a feature to prevent or at least minimize a return flowof heat. There are no known semiconductor materials with the highSeeback coefficients to maximize the structure used for the heatdelivering capability and, at the same time, the P-type and N-typesemiconductor elements must function to minimize the heat flowing backeither by decreasing heat generation i.e., lowering the electricresistance or by increasing thermal insulation.

The present invention seeks to provide a semiconductor structure forelectronically combining thermoelectric and convective heat transfermethods to build a high heat flux exchanger for heat transfer in asemiconductor package in the field of thermal cooling. The semiconductorpackage utilize the Peltier effect and have the advantages of no movingparts, a lightweight construction, maintenance-free and quiet operation,and an environmentally friendly construction. The Peltier effect is thetransport of heat by an electric current but the flow of heat changesabruptly at a PN junction between the two dissimilar materials by eitherliberating or absorbing heat. Within each branch of the junction thecurrent conducts heat, rather than generating heat. The efficiency ofrefrigeration is much lower than Carnot refrigeration efficiency. Due tolow efficiency between electric power and thermal energy, this methodhas been usually viewed as a viable technology only for use in lowcapacity cooling applications.

Accordingly, it is an object of the present invention to provide acomposite P element and a composite N element instead of puresemiconductor elements, the composite P element is doped with P-typematerial and the composite N element is doped with N-type material andthe composite elements are arranged to form a structure forthermoelectric cooling.

Another object of the present invention is to increase the efficiency ofa thermoelectric semiconductor package for viable usages such as incommercial and residential refrigerators using semiconductor material atless expense than other thermoelectric technology and eliminateenvironmentally threatening use of refrigerants.

It is a further object of the present invention to provide athermoelectric semiconductor package particularly useful forrefrigerators and air conditioners as well as cooling operation ofmedical instruments, computers, infrared optical equipment andintermittent temperature control such as vending machines.

It is another object of the present invention to provide athermoelectric semiconductor embodied as a composite P-type element anda composite N-type element to reduce heat generation by thesemi-conductor and increase heat flux from the hot source to the coldsource or from the cold source to the hot source as determined by thepolarity of the applied electric current.

It is another object of the present invention to provide multistagecomposite thermoelectric module to not only increase the temperaturedifferential between the refrigeration temperature and heat sinktemperature but also increase the thermal capacity for removing heatfrom the refrigeration area.

BRIEF SUMMARY OF THE INVENTION

More particularly, the present invention provides a thermoelectricsemiconductor structure including the combination of a P-type compositecomprised of a plurality of dices of semiconductor material alloyed withP-type material forming spaced collector regions at junctions with aP-type conductive material for flux of electrical current, and a N-typecomposite comprised of a plurality of dices of semiconductor materialalloyed with N-type material forming spaced collector regions atjunctions with a N-type conductive material for flux of electricalcurrent, the thickness of each the dices being sufficient to form a PNjunction thereof, and an electrically conductive buss bar forming anelectrical circuit connection between the dices of N-type conductivityand the dices of P-type conductivity; and terminals for applying anelectrical potential between the P-type composite and the N-typecomposite to induce a flux of heat concurrent with the flux ofelectrical current.

The present invention also provides a thermoelectric semiconductorstructure including the combination of a composite comprised of aplurality of dices of semiconductor material alloyed with P-typematerial or N-type material forming spaced collector regions atjunctions with a conductor of the same type conductive material for fluxof electrical current, a plurality of dices of semiconductor materialalloyed with P-type or N-type material forming PN junctions with thecomposite conductor for flux of electrical current, the thickness ofeach the dices being sufficient to form a PN junction thereof, andplurality of thermal electric junctions connected in series byelectrically conductive busses, and terminals to apply an electricallycurrent across the PN junctions to induce a flux of heat concurrent withthe flux of electrical current.

The present invention also provides a thermal electric structureincluding a plurality of thermal electric junctions connected in seriesby electrically conductive busses, and terminals to apply anelectrically current across the serially connected thermal electricjunctions, each of the thermal electric junctions comprising anelongated semiconductor of either N-type or P-type conductivity joinedin an end-to-end relation between an elongated electrical conductor andone of the electrically conductive busses, a first semiconductor dice ofa conductivity type different from conductivity type of the elongatedsemiconductor joined with the elongated electrical conductor oppositethe elongated semiconductor for establishing a composite P-N junctionfor both high thermal flux and high electrical flux; and an elongatedconduit of the same conductivity type as the first semiconductor diceconnected for a high electrical flux return path and a low heat fluxreturn path from the first semiconductor dice to a second semiconductordice, the second semiconductor dice joined to another of theelectrically conductive busses.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

The present invention will be more fully understood when the followingdescription is read in light of the accompany drawings of which:

FIG. 1 is an illustration of a conventional, well known in the art,thermoelectric semiconductor module;

FIG. 2 is an illustration of a composite thermoelectric semiconductormodule embodying the features of the present invention;

FIG. 3 illustrates a hybrid composite thermoelectric semiconductorembodying the features of the present invention;

FIG. 4 illustrates in detail a further embodiment of the hybridcomposite thermoelectric semiconductor structure;

FIG. 5 plurality of the hybrid composite thermoelectric semiconductorstructure illustrated in FIG. 4 and electrically connected in a serial;and

FIG. 6 illustrates a multistage composite thermoelectric moduleaccording to a further embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

A first embodiment of a thermoelectric semiconductor structure 10according to the present invention is illustrated in FIG. 2 and includesat least one P-type composite 12 but usually a plurality of which threeP-type composites 12 are shown. Each P-type composite 12 is comprised oftwo dices 14 of semiconductor material alloyed with P-type materialforming spaced collector regions at junctions 16 with a P-typeconductive material 18 for flux of electrical current. The P-typeconductive material 18 is hole-type material, for example, graphite. Thesemiconductor structure 10 further includes at least one N-typecomposite 20 but usually a plurality of composites of which three N-typecomposites 20 are shown. Each N-type composite is comprised of two ofdices 22 of semiconductor material alloyed with N-type material formingspaced collector regions at junctions 24 with an N-type conductivematerial 26 for flux of electrical current. The N-type conductivematerial 26 is electron carrier type material, for example, copper. Thenumber of P-type composites 12 are preferably equal to the number ofN-type composites 20 and arranged as an alternating occurrence in aseries electrical circuit formed by buss bars 30 comprised of copper orother suitable electrically conductive material. Electrically conductiveterminal bars 32 and 34 form electrical circuit connections between thedices 22 of N-type conductivity and the dices 14 of P-type conductivityto induce a flux of heat concurrent with the flux of electrical current.The use of buss bars to form the series electrical circuit increases toelectrical resistance of the electrical circuit so that the circuitoperates at a higher voltage and provides the desired feature accordingto the present invention of a faster cooling rate by the use of electriccurrent in a range up to, for example, 20 ampere and greater. The fluxof heat is in the direction of the arrow 36 located in a refrigerationsite, for example, through a high thermal conductivity ceramic plate 38and then as a heat flux through the P-type and N-type composites 12 and20 including the PN junctions thereof to heat sink formed by a highthermal conductivity ceramic plate 40 where the heat is released in thecooling channel in the direction indicated by arrows 42. However, it issufficient according to the present invention that since the buss bars30 are part of the flux path of heat that the buss bars act alone torelease heat to the cooling channel, therefore the ceramic plate 40 canbe eliminated if desired. The ceramic plates 38 and 40 are, for example,comprised of aluminum oxide, i.e. Al₂O₃ serve the important functions ofproviding enhanced thermal conduction and also to electrically insulatethe thermal electric module from the surrounding environment. Theprovision of the P-type composites and N-type composites allow thethickness of P and N dices to be very thin and thereby reduce the totalheat generation by the flux of electrical current in the dices toincrease the thermoelectric efficiency. Preferably, the thickness of thedices 14 and 22 are as thin as possible, typically for example 1 mm orless. The critical thickness of each dices is a thickness larger thanthe thickness, and therefore sufficient, to form a P-N junction. Thethickness the dices must be sufficient to operated in the compositesconsisting of two dices of N-type conductivity joined by N-typeconductor and two dices of P-type conductivity connected joined by aP-type conductor. The construction thermoelectric semiconductorstructure 10 using P-type and N-type composites allows the choice ofconductive material 18 and 26 from a variety different materials havinga very low electric resistance and with physical configurations to allowa selection of the location for a cooling zone and a heat sink. Theconductive material 18 and 26 can take the form of shaped structures,for example, a heavy duty cable comprised of a solid mass or wire likestrands, filaments or the like. Preferably one or both of conductors ofN-type conductivity and P-type conductivity are mechanicallysufficiently flexible for selectively establishing a desired heatdischarge site for flux of heat as indicated by arrow 42. The mechanicalflexible feature of the present invention allows that the orientation ofthe heat discharge site to be remotely spaced and when desired angularlyorientated as desired in relation to the heat source.

FIG. 3 illustrates a hybrid composite thermoelectric semiconductorstructure 100 comprised of semiconductor members 102 of one of P-type orN-type semiconductor material and composites 104 of the other of P-typeor N-type semiconductor material. Each of the composite 104 is comprisedof two dices 106 of semiconductor material alloyed with the selected oneof the P-type or N-type semiconductor material forming spaced collectorregions at junctions 108 with a conductive material 110 of the same typeconductivity for flux of electrical current. Thus, for example, whensemiconductor members 102 are P-type, then composites 104 are of N-typematerial. Buss bars 112 which can take the form of thick copper stripsfor serial electrical connection between the semiconductor members 102and composites 104. Terminals 114 and 116 apply the electric potentialof direct current to produce the concurrent flux of electric current andheat in the hybrid composite thermoelectric semiconductor structure 100.As in the embodiment of FIG. 2, the flux of heat is in the direction ofthe arrow 36 located in a refrigeration site, for example, through ahigh thermal conductivity ceramic plate 38 and then as a heat fluxthrough the semiconductor members 102 and composites 104 including thePN junctions thereof to heat sink formed by the high thermalconductivity ceramic plate 40 where the heat is released in the coolingchannel in the direction indicated by arrows 42.

FIG. 4 illustrates a hybrid composite thermoelectric semiconductorstructure which for the purpose of only illustrating this embodiment ofthe invention includes a N-type composite 118 comprised of a N-typesemiconductor 120 joined by a N-type conductive material 122 of, forexample, copper for the concurrent flux of heat and electrical current.The conductive material 122 forms a junction with a P-type semiconductorcomposite 124. The composite 124 is comprised of two dices 126 and 128of P-type semiconductor material joined by a P-type composite 130 toinduce a flux of electrical current concurrent with a flux of heat. Itis within the scope of the present invention to alter the selections ofsemiconductor materials by constructing the semiconductor 120 of P-typesemiconductor material and composite 124 comprised of two dices 126 and128 of N-type semiconductor material joined by a N-type composite 130.In the illustrated embodiment, the dice 126 forms a hot junction 132with the N-type conductive material 122 and the dice 128 form a coldjunction 134 with a buss bar 136. Another buss bar 137 is joined withthe semiconductor 120 and together with buss bar 136 are electricallyconnected to a suitable source of direct current for inducing the heatflux flow. This arrangement of the P-type semiconductor composite 124enables the use of the P-type composite 130 having low electricalresistance for good electrical efficiency and low heat flow propertiesfor a high thermal heat transfer capacity. The conductor 122 can beequipped with heat transfer fins for improving the flow of heat into thecooling channel. Moreover, the P-type composite 130 can be embodied in avariety of different shapes with elongated dimensions to suit theoperating environment. It is desired and intended that the flux of heatis dissipated at the hot junction 132 and along a length of the P-typeconductor residing in a cooling channel indicated by arrow 138 boundedby spaced apart plates 140 and 142 for heat transfer to an air flowalong cooling channel. Heat is moved from the refrigeration area in thedirection indicated by arrow 144 through the high thermal conductivityceramic plate 146, and then carried to the hot junctions 132 at theceramic plate 140 and released in the cooling channel 138. The ceramicplates 140 and 146 are, for example, comprised of aluminum oxide, i.e.Al₂O₃. However, the plate 142 forming part of the cooling channel can bemade from an electrical insulating material, such as for example mica,for electrical isolation since thermal conductivity is not particularlyimportant at this site in the thermal electric structure.

The embodiment illustrated in FIG. 4 is more fully shown in FIG. 5wherein there is a plurality of N-type composites 118 ₁, 118 ₂, - - -118 _(N and) a plurality of P-type semiconductor composites 124 ₁, 124₂, - - - 124 _(N) electrically connected in a serial configuration bythe buss bars 136 and 137. The very small electrical resistance of eachcomposite are additive according to the series connections and thereforeprovide the desirable feature of allowing the use of an increasedvoltage and amperes levels for reduce heat generation by thesemi-conductors and increase heat flux from the hot source to the coldsource or from the cold source to the hot source as determined by thepolarity of the applied electric current. The row formation of multiplehybrid composite thermoelectric semiconductor structures shown in FIG. 5can be repeated to provide an M×N array between ceramic plates.

FIG. 6 illustrates a multistage composite thermoelectric module 150 tonot only increase the temperature differential between the refrigerationtemperature and heat sink temperature but also increase the thermalcapacity for removing heat in the direction of arrow 164 from therefrigeration area. Two stage P-type composites 152 and 154 are eachcomprised of two dices 156 and 158 of P-type semiconductor materialjoined by a P-type conductive material 160 to induce a flux ofelectrical current concurrent with a flux of heat. The dices 156 of eachstage are joined to a buss bar 162 for heat transfer to an air flowalong cooling channel indicated by arrow 166. The dices 158 of eachstage are joined to separate buss bars 168 and 170. A ceramic layer 172comprised of, for example, aluminum oxide, i.e. Al₂O₃ separates buss bar168 from an underlying P-type conductive material 160. Two stage N-typecomposites 182 and 184 are each comprised of two dices 186 and 188 ofN-type semiconductor material joined by an N-type conductive material190 to induce a flux of electrical current concurrent with a flux ofheat. The dices 186 of each stage are joined to a buss bar 162 for heattransfer to a flow of a heat transfer medium along cooling channel 166.Examples of a suitable heat transfer medium by convection are air andwater. The necessary disposal of heat is by heat transfer usingtechniques of convection, conduction, boiling including heat pipe, orradiation and including combinations of these techniques. The dices 188of each stage are joined to the separate buss bars 168 and 170 and theceramic layer 172 also separates buss bar 168 from an underlying N-typeconductive material 190. The buss bars 162, 168, 170 and 192 form theserial arrangement for electrical flux by the hybrid compositethermoelectric semiconductor structure and the multistage arrangement ofthe P-type composites 152 and 154 and the N-type composites 182 and 184form the highly efficient thermal flux. This arrangement of multistagecooling modules provides that the two dices 156 of P-type semiconductormaterial are superimposed and have a common heat flux origin whereas theremaining two dices 158 of P-type semiconductor material are spacedapart and operate at independently spaced heat flux site along the busbar 162. Similarly, two dices 186 of N-type semiconductor material aresuperimposed and have a common heat flux origin whereas the remainingtwo dices 188 of N-type semiconductor material are spaced apart andoperate at independently spaced heat flux site along the bus bar 162.This construction and arrangement of parts provides the increase to thetemperature differential between the refrigeration temperature and heatsink temperature and the increase to the thermal capacity for removingheat from the refrigeration area.

The net heat being carried from the cold junction (heat resource) to thehot junction (heat sink) is equal to the total power of the heatcarrying capacity for defined P-type and N-type semiconductor materialsreduced by the heat transfer from the hot junction to the cold junctionand also reduced by the heat dissipation due to the electric resistanceof the P-type and N-type semiconductor materials. Accordingly, itfollows that by reducing the magnitude of the last two items, the heattransfer and heat dissipation, will produce an increase to the totalheat pumped from a cold junction to a hot junction without changing theP-type and N-type materials and thereby the refrigeration efficiency canbe increased by reducing energy dissipation and heat transfer between acold junction and a hot junction. The lowering of the electricalresistively reduces the electrical energy dissipation and produces theresult of an increase to the net heat carried from the cold junction tothe hot junction. The refrigeration efficiency noticeably increases.

In current commercial market, Bi₂Te₃—Sb₂Te₃ based material as P-typesemiconductor and Bi₂Te₃—Bi₂Se₃ based material as N-type semiconductorare most commonly used thermoelectric materials. The electricalresistively of Bi₂Te₃—Sb₂Te₃ based material as P-type semiconductor andBi₂Te₃—Bi₂Se₃ based material as N type semiconductor both are around10⁻⁵ Ωm. The electric resistance rate of copper is 1.7 10⁻⁸ Ωm. Theresistivity of current commercial semiconductor materials is onethousand times higher than that of copper. Thus copper as the N-typeconductor replacing N-type semiconductor will significantly reduce thetotal resistivity of the N element and give a great increase to therefrigeration efficiency. The conductors having the form of shapedstructures such as a heavy duty cable comprised of a solid mass or wirelike strands, filaments or the like allows one or both of conductors ofN-type conductivity and P-type conductivity mechanically flexible forselecting the desired heat discharge site for flux of heat, an importantfeature of the present invention. As explained in regard to theembodiment of FIG. 2, it is sufficient according to the presentinvention that since the buss bars are part of the flux path of heatthat the buss bars act alone to release heat to the cooling channel,therefore the ceramic plate is an optional addition but desired.

The composite thermoelectric structures of the present invention producethree quantitative advantages. First, the composite structure greatlyincreases the value of the coefficient of performance by increasing theheat transfer from the cold junction to the hot junction. The reducedsize of the semiconductor deices reduce the energy dissipation and heattransfer between the cold junction and the hot junction. The electricresistance of P or N element will produce two effects. If the capacityof Peltier effect is fixed, decreasing the electric dissipation (due toelectrical resistance) will effectively increase the total heat removalfrom the cold junction to the hot junction. As another effect, the totalwork being done decreases during carrying heat. Both of these effectscontribute to increase the value of the coefficient of operation. As thesecond advantage, this design increases the capacity of carrying heat.This technology not only increase the total capacity of carrying heat bydecreasing the electric dissipation but also increase the total capacityby increasing electric current density.

While the present invention has been described in connection with thepreferred embodiments of the various figures, it is to be understoodthat other similar embodiments may be used or modifications andadditions may be made to the described embodiment for performing thesame function of the present invention without deviating therefrom.Therefore, the present invention should not be limited to any singleembodiment, but rather construed in breadth and scope in accordance withthe recitation of the appended claims.

1. A thermoelectric semiconductor structure including the combinationof: a P-type composite comprised of a plurality of dices ofsemiconductor material alloyed with P-type material forming spacedcollector regions at junctions with a P-type conductive material forflux of electrical current; a N-type composite comprised of a pluralityof dices of semiconductor material alloyed with N-type material formingspaced collector regions at junctions with a N-type conductive materialfor flux of electrical current, the thickness of each said dices beingsufficient to form a PN junction thereof; an electrically conductivebuss bar forming an electrical circuit connection between one of saiddices of N-type conductivity and one of said dices of P-typeconductivity; and terminals for applying an electrical potential betweensaid P-type composite and said N type composite to induce a flux of heatconcurrent with the flux of electrical current.
 2. The thermoelectricstructure according to claim 1 wherein the combination further includesa plurality of said P-type composite and a plurality of said N-typecomposite, and wherein said electrically conductive buss barinterconnects said plurality of said P-type composite and a plurality ofsaid N-type composite forming a series circuit electrical circuit. 3.The thermoelectric structure according to claim 2 wherein said buss barfurther includes an electrical conductor joining a dices of said P-typeconductivity with a dices of said N-type conductivity.
 4. Thethermoelectric structure according to claim 3 wherein said electricalconductor electrically separates hot junctions from cold junctions. 5.The thermoelectric structure according to claim 1 wherein at least oneof said N-type conductive material and said P-type conductive materialis sufficiently flexible for selectively establishing a desired heatdischarge site for said flux of heat.
 6. The thermoelectric structureaccording to claim 5 wherein said desired heat discharge site for saidflux of heat accomplishes the heat transfer by convection, conduction,boiling including heat pipe, or radiation and combinations thereof. 7.The thermoelectric structure according to claim 1 wherein each of saidN-type conductive material and said N-type conductive material aresufficiently flexible for selectively establishing a desired heatdischarge site for said flux of heat.
 8. The thermoelectric structureaccording to claim 1 further including a ceramic member for inducing aflux of heat concurrent with electrically insulating said electricallyconductive buss bar.
 9. A thermal electric structure including aplurality of thermal electric junctions connected in series byelectrically conductive busses, and terminals to apply an electricallycurrent across the serially connected hybrid thermal electric junctions,each of said thermal electric junctions comprising: an elongatedsemiconductor of either N or P-type joined in an end-to-end relationbetween an elongated either N or P-type conductive material and one ofsaid electrically conductive busses; a first semiconductor dice of atype different from type of said elongated semiconductor joined withsaid elongated either N or P-type conductive material opposite saidelongated semiconductor for establishing a hybrid P-N junction for bothhigh thermal flux and high electrical flux; and an elongated conduit ofthe same type conductivity as said first semiconductor dice connectedfor a high electrical flux return path and a low heat flux return pathfrom said first semiconductor dice to a second semiconductor dice of thesame conductivity as said first semiconductor dice, said secondsemiconductor dice joined to another of said electrically conductivebusses.
 10. The thermoelectric structure according to claim 9 whereinthe combination further includes a plurality of said P-type compositeand a plurality of said N-type composite, and wherein said electricallyconductive busses interconnect said plurality of said P-type compositeand a plurality of said N-type composite forming a series circuitelectrical circuit.
 11. The thermoelectric structure according to claim10 wherein at least one of said conductor of N-type conductivity andsaid conductor of P-type conductivity is sufficiently flexible forselectively establishing a desired heat discharge site for said flux ofheat.
 12. The thermoelectric structure according to claim 11 whereinsaid desired heat discharge site for said flux of heat accomplishes theheat transfer by convection, conduction, boiling including heat pipe, orradiation and combinations thereof.
 13. The thermoelectric structureaccording to claim 11 wherein said either N or P-type conductivematerial comprise shaped structures having mechanically sufficientlyflexible for selectively establishing a desired heat discharge site forflux of heat to allow the orientation of the heat discharge site to beremotely spaced and when desired angularly orientated as desired inrelation to the heat source.
 14. The thermoelectric structure accordingto claim 9 further including a ceramic member for inducing a flux ofheat concurrent with electrically insulating said electricallyconductive busses.
 15. A multistage composite thermoelectric moduleincluding the combination of multistage P-type composites each comprisedof two dices of P-type semiconductor material joined by a P-typeconductive material to induce flux of electrical current concurrent witha flux of heat, one dice of P-type semiconductor of each of twoP-composites having a common heat flux origin and the remaining one ofthe P-type semiconductor of each of said two P-type composites havingindependently spaced heat flux site for increasing the temperaturedifferential between the refrigeration temperature and heat sinktemperature increasing the thermal capacity for removing heat from therefrigeration area, and multistage N-type composites each comprised oftwo dices of N-type semiconductor material joined by a N-type conductivematerial to induce flux of electrical current concurrent with a flux ofheat, one dice of N-type semiconductor of each of two N-compositeshaving a common heat flux origin and the remaining one of the N-typesemiconductor of each of said two N-type composites having independentlyspaced heat flux site for increasing the temperature differentialbetween the refrigeration temperature and heat sink temperatureincreasing the thermal capacity for removing heat from the refrigerationarea.
 16. The thermoelectric structure according to claim 15 wherein thecombination further includes a plurality of said P-type composite and aplurality of said N-type composite, and wherein said electricallyconductive busses interconnect said plurality of said P-type compositeand a plurality of said N-type composite forming a series circuitelectrical circuit.
 17. The thermoelectric structure according to claim16 wherein at least one of said N-type conductive material and saidP-type conductive material is sufficiently flexible for selectivelyestablishing a desired heat discharge site for said flux of heat. 18.The thermoelectric structure according to claim 16 wherein said at leastone of said N-type conductive material and said P-type conductivematerial comprise shaped structures having mechanically sufficientlyflexible for selectively establishing a desired heat discharge site forflux of heat to allow the orientation of the heat discharge site to beremotely spaced and when desired angularly orientated as desired inrelation to the heat source.
 19. The thermoelectric structure accordingto claim 15 further including a ceramic member for inducing a flux ofheat concurrent with electrically insulating said electricallyconductive busses.
 20. The thermoelectric structure according to claim15 wherein said independently spaced heat flux site accomplishes theheat transfer by convection, conduction, boiling including heat pipe, orradiation and combinations thereof.